Welcome to our Product/Process Change Notification (PCN) pages from the last five years. To locate PCNs, please select year from the menu on this page.
Each PCN provides Contact and Implementation Dates, Alert Category and Type, PCN Number, Title, Impact, Description of Change, and a complete list of products manufactured by Diodes, Inc. that are affected by the product/process changes indicate. To view PCN, please click PCN# PDF.
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PCN # | Issue Date | Implementation Date | Product Family | Change Type | Related Part Numbers |
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PCN-2325 – Rev 3 (Interim Update) | 2018-04-20 | 2020-11-20 | Analog | Fab Porting from Global Foundries to MagnaChip |
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PCN-2324 | 2018-02-28 | 2018-05-28 | Discrete Automotive | Addition of A Passivation Layer Over The Top Metal of The Die for Selected Automotive BJT Devices |
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PCN-2322 (Advance Notice) | 2018-03-19 | 2020-03-15 | Analog Automotive | Fab Porting from Global Foundries to MagnaChip |
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PCN-2321 | 2018-02-22 | 2018-08-22 | Analog | Device End of Life (EOL) |
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PCN-2319 | 2018-03-09 | 2018-06-09 | Discrete Automotive | Qualification of Alternative Wafer Sources for Select Automotive Products Due to Closure of Diodes FabTech (KFAB) Facility |
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PCN-2318 | 2018-01-22 | 2018-01-22 | Discrete | Device End of Life (EOL) |
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PCN-2315 | 2018-03-09 | 2018-06-09 | Discrete | Qualification of Alternative Wafer Sources for Select Products Due to Closure of Diodes FabTech (KFAB) Facility |
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PCN-2313 | 2019-10-21 | 2020-01-21 | Discrete | Qualification of "Diodes Technology (Cheng Du) Company Limited" (CAT) as an Additional Assembly & Test Site, Conversion to Copper Bond Wire, and Qualification of Additional Die Passivation Layer on Select Products |
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PCN-2312 | 2018-04-11 | 2018-07-11 | Analog | Qualification of Additional Bill of Materials (BOM), Top Marking, and Fab Source for Select Products |
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PCN-2311 | 2018-05-22 | 2018-11-22 | Analog Automotive | Device End of Life (EOL) |
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PCN-2310 | 2018-01-24 | 2018-01-24 | Analog | Device End of Life (EOL) |
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PCN-2305 | 2018-02-28 | 2018-05-28 | Discrete | Addition of A Passivation Layer Over The Top Metal of The Die for Selected BJT Devices |
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PCN-2304 | 2018-01-05 | 2018-04-05 | Analog | Additional Qualified Fab Source for MOSFET Devices and BOM (Bill of Materials) on Selected Devices |
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PCN-2300 | 2018-03-07 | 2018-06-07 | Discrete | Qualification of Additional Assembly and Test Sites |
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PCN-2299 | 2018-03-01 | 2018-06-01 | Analog | Additional Qualified (A/T) Assembly Test Site |
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PCN-2293 | 2018-01-16 | 2018-01-16 | Analog | Fab Transfer for PT7C4512WE and PT7C4512WEX Devices Due to Current Fab Closure |
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PCN-2292 | 2018-01-17 | 2018-04-17 | Analog | Die Revision Upgrade |
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